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PDF “Change in Electrical Characteristics of Poly(p-phenylene vinylene)-Based Self-Assembled Devices by Addition of Ionic Salt to Poly(sodium 4-styrenesulfonate)” Jinhan Cho, K.Char, S.-Y. Kim, J.-D. Hong, D. Y. Kim, and K.-B. Lee Synthetic Met. 2001, 124(2-3), 415-429. DOI: doi.org/10.1016/S0379-6779(01)00383-6ISSN: 0379-6779 Publication Date (Web): 14 November 2001Publication Date (Print): 22 October 2001 Supplementary Information: None. Acknowledgments: This work […]

PDF “Fabrication of Highly Ordered Multilayer Films Using Spin Self-Assembly Method” Jinhan Cho, Kookheon Char, Jong-Dal Hong and Ki-Bong Lee Adv. Mater. 2001, 13, 1076-1078. DOI: doi.org/10.1002/1521-4095(200107)13:14<1076::AID-ADMA1076>3.0.CO;2-M ISSN: 0935-9648 Publication Date (Web): 12 July 2001 Publication Date (Print): 18 July 2001 Supplementary Information: None. Acknowledgments:

PDF “Effect of Ionic Salt on the Quantum Efficiency of Self-Assembled Films Prepared with Poly(p-phenylene vinylene)” Jinhan Cho, K. Char, S.-Y. Kim, J.-D. Hong, S. K. Lee and D. Y. Kim, Thin Solid Films, 2000, 379(1-2), 188-194. DOI: doi.org/10.1016/S0040-6090(00)01555-8 ISSN: 0040-6090 Publication Date (Web): 18 December 2000 Publication Date (Print): 8 December 2000 Supporting Information:

PDF “Electronic Characteristics of Self-Assembled Hybrid Devices Based on PPV and CdS Nanoparticles” Jinhan Cho, K. Char, J.-D. Hong, D. Y. Kim Mol. Cryst. Liq. Crys. A. 2000, 349(1), 183-186 (October). DOI: doi.org/10.1080/10587250008024895 ISSN: 1058-725X Publication Date (Web): 24 September 2006 Publication Date (Print): October 2000 Supplementary Information : None. Acknowledgments

PDF “Colloid Surface Engineering via Deposition of Multilayered Thin Films from Polyelectrolyte Blend Solutionsid” Heng Pho Yap, John F. Quinn, Sok Mian Ng, Jinhan Cho and Frank Caruso Langmuir. 2005, 21(10), 4328-4333. DOI: doi.org/10.1021/la047156n ISSN: 0743-7463 Publication Date (Web): 16 April 2005 Publication Date (Print): 01 May 2005 Supplementary Information: None. Acknowledgments: The authors acknowledge funding from the Australian

PDF “Effect of curing temperature on the adhesion strength of polyamideimide/copper joints” Jinhan Cho, D. I. Kong, C. E. Park and M. Y. Jin J. Adhes. Sci. Technol 1998, 12, 507-521. DOI: doi.org/10.1163/156856198X00191ISSN: 0619-4243 Publication Date (Web): 02 April 2012Publication Date (Print): 1988 Supporting Information: None. Acknowledgments: This work was supported by the Korea Research Institute of Chemical