[1998]Journal of Adhesion Science and Technology 1998, 12, 507-521. (IF =0.863)
PDF “Effect of curing temperature on the adhesion strength of polyamideimide/copper joints” Jinhan Cho, D. I. Kong, C. E. Park and M. Y. Jin J. Adhes. Sci. Technol 1998, 12, 507-521. DOI: doi.org/10.1163/156856198X00191 ISSN: 0619-4243 Publication Date (Web): 02 April 2012 Publication Date (Print): 1988 Supporting Information: None. Acknowledgments: This work was supported by the Korea Research Institute …
[1998]Journal of Adhesion Science and Technology 1998, 12, 507-521. (IF =0.863) 더 보기 »