“Effect of curing temperature on the adhesion strength of polyamideimide/copper joints”
Jinhan Cho, D. I. Kong, C. E. Park and M. Y. Jin
J. Adhes. Sci. Technol 1998, 12, 507-521.
DOI: doi.org/10.1163/156856198X00191
ISSN: 0619-4243
Publication Date (Web): 02 April 2012
Publication Date (Print): 1988
Supporting Information: None.
Acknowledgments: This work was supported by the Korea Research Institute of Chemical Technology and partially supported by the Center for Advanced Functional Polymers.