[2012]Microelectronics Reliability 2012, 52(7), 1441-1444 (IF = 1.202)
PDF “Improved reliability of copper-cored solder joints under a harsh thermal cycling condition” Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin, Jinhan Cho, Heeman Choe* * Corresponding Author Microelectron. Reliab. 2012, 52(7), 1441-1444. DOI: doi.org/10.1016/j.microrel.2012.03.001 ISSN: 0026-2714 Publication Date (Web): 27 March 2012 Publication Date (Print): July 2012 Supporting Information: None. Acknowledgments: This work was […]
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