“Improved reliability of copper-cored solder joints under a harsh thermal cycling condition”
Yunsung Kim, Hyelim Choi, Hyoungjoo Lee, Dongjun Shin, Jinhan Cho, Heeman Choe*
* Corresponding Author
Microelectron. Reliab. 2012, 52(7), 1441-1444.
DOI: doi.org/10.1016/j.microrel.2012.03.001
ISSN: 0026-2714
Publication Date (Web): 27 March 2012
Publication Date (Print): July 2012
Supporting Information: None.
Acknowledgments: This work was supported by the National Research Foundation (NRF) grant funded by the Korea government (MEST) (2010-0029106)